Abstract
We report a method for integrating GaAswaveguide circuits containing self-assembled quantum dots on a Si/SiO2 wafer, using die-to-wafer bonding. The large refractive-index contrast between GaAs and SiO2 enables fabricating single-mode waveguides without compromising the photon-emitter coupling. Anti-bunched emission from individual quantum dots is observed, along with a waveguide propagation loss
Original language | English |
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Journal | Optics Express |
Volume | 30 |
Issue number | 21 |
Pages (from-to) | 37595-37602 |
Number of pages | 8 |
ISSN | 1094-4087 |
DOIs | |
Publication status | Published - 10 Oct 2022 |
Keywords
- PLATFORM
- CHIP
- DIE